logo
หน้าแรก > ผลิตภัณฑ์ > การประกอบ PCB การสื่อสาร >
Min Hole Diameter 0.1mm Communication PCB Assembly Designed to Meet ROHS Standards and Board Thickness 0.2 to 6mm for Connectivity

Min Hole Diameter 0.1mm Communication PCB Assembly Designed to Meet ROHS Standards and Board Thickness 0.2 to 6mm for Connectivity

สถานที่กำเนิด:

จีนหรือกัมพูชา

ชื่อแบรนด์:

Suntek Electronics Co., Ltd

ได้รับการรับรอง:

ISO9001 ISO13485 IATF16949 UL

หมายเลขรุ่น:

2024-พีซีบีเอ-9657

ติดต่อเรา
ขอทุน
รายละเอียดผลิตภัณฑ์
ฟิลด์แอปพลิเคชัน:
การสื่อสาร 5G
ความหนาของบอร์ด:
0.2-6 มม.
PCB การสื่อสาร:
Tg170 สูง และ Tg180 สูง
ไวอาไทป์:
ทะลุผ่านรู ตาบอด ถูกฝัง
การควบคุมความต้านทาน:
ใช่
แพคเกจด้านนอก:
กล่องกระดาษ
กำหนดเอง:
ใช่
เส้นผ่านศูนย์กลางรูต่ำสุด:
0.1 มม
เงื่อนไขการชําระเงินและการจัดส่ง
จำนวนสั่งซื้อขั้นต่ำ
1 ชิ้น
ราคา
Customized products
เวลาการส่งมอบ
5-7 วันหลังจากส่วนประกอบทั้งหมด kitted
เงื่อนไขการชำระเงิน
tt, paypal
สินค้าที่เกี่ยวข้อง
ติดต่อเรา
ติดต่อตอนนี้
คำอธิบายผลิตภัณฑ์

Product Description:

The Communication PCB Assembly is a highly specialized printed circuit board designed to meet the rigorous demands of modern 5G communication systems. With the rapid advancement of telecommunications technology, the need for robust, reliable, and high-performance PCB solutions has never been greater. This product is meticulously engineered to support the complex requirements of communication infrastructure, ensuring seamless data transmission and enhanced signal integrity.

One of the standout features of this Communication PCB Assembly is its customizable size, allowing for tailored solutions that fit perfectly within diverse device specifications. Whether your application requires a compact PCB or a larger board, this product can be precisely manufactured to meet your unique needs. The board thickness can also be customized, ranging from 0.2mm to 6mm, providing flexibility in design and mechanical strength. This adaptability is crucial for various communication equipment, where space constraints and durability are key considerations.

The min hole diameter of 0.1mm highlights the precision manufacturing capabilities of this PCB assembly. Such fine drilling allows for the integration of high-density components, which is essential in 5G communication devices that demand miniaturization without compromising performance. These small vias and holes facilitate efficient electrical connections and signal routing, contributing to the overall efficiency and reliability of the communication system.

Incorporating surge protection is a critical aspect of this Communication PCB Assembly. Communication infrastructure often faces exposure to electrical surges caused by lightning strikes, power fluctuations, or other transient events. This PCB assembly is designed to integrate surge protection components that safeguard sensitive electronic circuits from damage. By mitigating the risk of electrical surges, the assembly enhances the longevity and stability of communication equipment, ensuring uninterrupted service and minimizing downtime.

Another significant attribute of this product is its capability to handle heavy current loads. Communication infrastructure components often require the transmission of substantial electrical currents to power various modules and maintain signal strength. The Communication PCB Assembly is engineered to support heavy current applications, featuring robust copper traces and optimized thermal management. This ensures that the PCB can operate safely and efficiently under demanding electrical conditions, preventing overheating and maintaining signal integrity.

The customization aspect of this Communication PCB Assembly extends beyond size and thickness. Customers can specify various parameters to suit their specific application needs, including material selection, surface finish, and layer count. This level of customization ensures that each PCB assembly is perfectly aligned with the functional and environmental requirements of 5G communication equipment. Whether used in base stations, antennas, or other critical components of communication infrastructure, this PCB assembly delivers superior performance and reliability.

In summary, the Communication PCB Assembly is an advanced, customizable solution tailored for the evolving landscape of 5G communication. Its precision with a minimum hole diameter of 0.1mm, flexible board thickness ranging from 0.2mm to 6mm, and ability to support heavy current applications make it an ideal choice for modern communication infrastructure. The integration of surge protection further enhances its robustness, protecting vital electronic components from electrical hazards. By offering a fully customizable design, this PCB assembly empowers engineers and manufacturers to create cutting-edge communication devices that meet the highest standards of quality and performance.

Whether you are upgrading existing communication systems or developing new 5G technologies, this Communication PCB Assembly provides the essential foundation for reliable, high-speed, and durable communication solutions. Its advanced features and adaptability ensure it can meet the challenges of today’s fast-paced communication environment, making it an indispensable component in the field of telecommunications.

 

Features:

  • Product Name: Communication PCB Assembly
  • Surface Finishing: ENIG, HASL Lead Free for enhanced durability and conductivity
  • Minimum Hole Diameter: 0.1mm for precise component placement
  • PCB Layers: 6 Layers to support complex circuit designs
  • Specification: PCB Customized Size tailored to specific project requirements
  • Application Field: 5G Communication, ideal for modern communication infrastructure
  • Includes surge protection features to ensure reliability under voltage spikes
  • Incorporates thick copper layers for improved current carrying capacity and thermal management
 

Technical Parameters:

Pcb Layers 6 Layers
Min Hole Diameter 0.1mm
Viatype Through Hole, Blind, Buried
Surface Finishing ENIG, HASL Lead Free
Outer Package Carton
Customized Yes
Pcb Quality System ROHS
Communication Pcb High Tg170 And High Tg180
Board Thickness 0.2-6mm
Specification PCB Customized Size
 

Applications:

The Communication PCB Assembly plays a crucial role in modern communication infrastructure, providing the backbone for reliable and efficient data transmission. Designed with a board thickness ranging from 0.2mm to 6mm, this product offers versatility suitable for various communication devices and equipment. Its customizable PCB size specifications enable manufacturers to tailor the assemblies precisely to their project requirements, ensuring optimal performance and seamless integration within complex communication systems.

One of the key application occasions for the Communication PCB Assembly is in the development and maintenance of communication infrastructure, including routers, switches, base stations, and signal processing units. The ability to customize the solder mask color, such as blue or green, allows manufacturers to meet specific aesthetic and functional needs while enhancing the durability and protection of the circuit boards. This attention to detail ensures that the assemblies can withstand environmental challenges and maintain stable operation over extended periods.

In scenarios involving heavy current applications, the Communication PCB Assembly is engineered to handle increased electrical loads safely and efficiently. The minimum hole diameter of 0.1mm supports fine pitch components and high-density circuit layouts, which are vital for advanced communication equipment that demands compactness and precision. Manufacturers targeting sectors such as telecommunications, data centers, and network infrastructure rely on these assemblies to deliver high performance under demanding operational conditions.

The outer packaging in durable cartons ensures that the Communication PCB Assemblies arrive at the manufacturing site or installation location in pristine condition, free from damage during transit. This careful packaging is essential for maintaining the integrity of the delicate electronic components and ensuring a smooth production process. Whether used in large-scale infrastructure projects or smaller communication devices, these assemblies provide a dependable solution that supports the continuous evolution of communication technology.

In summary, the Communication PCB Assembly is indispensable for manufacturers focused on advancing communication infrastructure. Its customizable specifications, robust design for heavy current applications, and attention to packaging detail make it an ideal choice for a wide array of communication scenarios, ensuring reliability, efficiency, and longevity in critical electronic systems.

 

Customization:

Our Communication PCB Assembly product offers comprehensive customization services tailored to meet the specific needs of the 5G communication industry. With a minimum hole diameter of 0.1mm, we ensure precision and reliability in every board. We specialize in producing communication PCBs with high Tg170 and high Tg180 materials, providing excellent thermal stability for demanding applications.

Designed for communication infrastructure, our PCBs support heavy current loads and feature thick copper layers to enhance conductivity and durability. We offer fully customized PCB sizes to fit your unique project requirements, ensuring optimal performance in advanced 5G communication systems.

Choose our customized Communication PCB Assembly services to benefit from high-quality, reliable, and efficient solutions that meet the rigorous standards of modern communication technology.

 

Support and Services:

Our Communication PCB Assembly product is supported by a dedicated technical support team that provides comprehensive assistance throughout the product lifecycle. We offer expert guidance on installation, configuration, and troubleshooting to ensure optimal performance and reliability.

Services include detailed consultation on design for manufacturability, rigorous testing protocols, and firmware updates to keep your communication systems running smoothly. Our team is equipped to handle custom requirements and provide tailored solutions to meet your specific application needs.

Additionally, we provide maintenance services, including diagnostics and repairs, to minimize downtime and extend the operational life of your PCB assemblies. Our commitment is to deliver prompt, efficient, and professional support to help you achieve seamless communication infrastructure integration.

 

Packing and Shipping:

Our Communication PCB Assembly products are carefully packaged to ensure maximum protection during transit. Each assembly is placed in anti-static bags to prevent electrostatic discharge damage, followed by cushioned packaging materials to absorb shocks and vibrations.

The assemblies are then securely boxed in sturdy cartons designed to withstand handling and shipping conditions. We also include moisture barrier bags and desiccants when necessary to protect against humidity.

For shipping, we partner with reliable carriers to provide timely and safe delivery worldwide. Tracking information is provided for all shipments to keep our customers informed throughout the delivery process.

Special packaging requests can be accommodated upon customer inquiry to meet specific requirements or compliance standards.

 

 

Min Hole Diameter 0.1mm Communication PCB Assembly Designed to Meet ROHS Standards and Board Thickness 0.2 to 6mm for Connectivity 0

ส่งคำถามของคุณโดยตรงกับเรา

นโยบายความเป็นส่วนตัว จีนคุณภาพดี EMS PCBA ผู้จัดจำหน่าย ลิขสิทธิ์ © 2024-2025 Suntek Electronics Co., Ltd. สิทธิทั้งหมดถูกเก็บไว้